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CAMPUS® datasheet | VESTAMID L2140 blk (sw) 9.7504


This datasheet of VESTAMID L2140 blk (sw) 9.7504 from Evonik Industries AG is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:

  VESTAMID® L2140 blk (sw) 9.7504 | PA12 | Evonik Industries AG
Product Texts
VESTAMID® L2140 blk 9.7504


Resin:                ISO 1874-PA12, EHL,22-010

 

UL recognition: UL 94:HB, All colors, UL 746 B, RTI = 120/85/95°C

 

High viscosity resin for tubing extrusion, profiles and hollow parts. EG Standard 93/128.

 

Application examples: Tubing for the automobile industry according to

                                     DIN 73 378, Type; PA 12-HL

Rheological propertiesdry / condUnitTest Standard
Melt volume-flow rate (MVR) 30 / * cm³/10min ISO 1133
Temperature 275 / * °C ISO 1133
Load 5 / * kg ISO 1133
Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus 1400 / 1300 MPa ISO 527-1/-2
Yield stress 47 / 41 MPa ISO 527-1/-2
Yield strain 5 / 13 % ISO 527-1/-2
Nominal strain at break >50 / >50 % ISO 527-1/-2
Charpy impact strength (+23°C) N / N kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) N / N kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 16 / 12 kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 9 / 10 kJ/m² ISO 179/1eA
Thermal propertiesdry / condUnitTest Standard
Temp. of deflection under load (1.80 MPa) 50 / * °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 110 / * °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 140 / * °C ISO 306
Coeff. of linear therm. expansion (parallel) 140 / * E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion (normal) 140 / * E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB / * class IEC 60695-11-10
Thickness tested 1.6 / * mm IEC 60695-11-10
UL recognition UL / * - -
Burning Behav. at thickness h HB / * class IEC 60695-11-10
Thickness tested 3.2 / * mm IEC 60695-11-10
UL recognition UL / * - -
Electrical propertiesdry / condUnitTest Standard
Relative permittivity (100Hz) 3.7 / 4.8 - IEC 60250
Relative permittivity (1MHz) 3 / 3.3 - IEC 60250
Dissipation factor (100Hz) 450 / 700 E-4 IEC 60250
Dissipation factor (1MHz) 260 / 500 E-4 IEC 60250
Volume resistivity 1E13 / 3E12 Ohm*m IEC 60093
Surface resistivity * / 1E15 Ohm IEC 60093
Electric strength 26 / - kV/mm IEC 60243-1
Comparative tracking index * / 600 - IEC 60112
Other propertiesdry / condUnitTest Standard
Water absorption 1.5 / * % Sim. to ISO 62
Humidity absorption 0.7 / * % Sim. to ISO 62
Density 1010 / 1010 kg/m³ ISO 1183
Rheological calculation propertiesValueUnitTest Standard
Density of melt 860 kg/m³ -
Thermal conductivity of melt 0.2 W/(m K) -
Spec. heat capacity melt 3000 J/(kg K) -
Ejection temperature 170 °C -
Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 240 °C ISO 294
Injection Molding, mold temperature 80 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Injection Molding, pressure at hold 70 MPa ISO 294
Characteristics
Processing
Injection Molding, Profile Extrusion, Other Extrusion
Delivery form
Pellets
Additives
Lubricants
Special Characteristics
Light stabilized or stable to light, U.V. stabilized or stable to weather, Heat stabilized or stable to heat
Regional Availability
Other text information
Injection molding


PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. At a drying temperature of 80°C we recommend, depending on the water

content, a drying time of 8 - 16 hours. Fresh air dryers are acceptable, better would be a dry air or

vacuum dryer. Please note our product literature, plasticized resins can lose plasticizer du ring drying.

PROCESSING INFORMATION

Melt Temperature:220 - 260°C
Mold Temperature:30 - 100°C
Other extrusion

PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. At a drying temperature of 80 °C we recommend, depending on the water

content, a drying time of 8 - 16 hours. Fresh air dryers are acceptable, better would be a dry air or

vacuum dryer. Please note our product literature, plasticized resins can lose plasticizer during drying.


PROCESSING INFORMATION
Melt Temperature : 220 - 250 °C

Profile extrusion

PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. At a drying temperature of 80 °C we recommend, depending on the water

content, a drying time of 8 - 16 hours. Fresh air dryers are acceptable, better would be a dry air or

vacuum dryer. Please note our product literature, plasticized resins can lose plasticizer during drying.


PROCESSING INFORMATION
Melt Temperature : 220 - 250 °C

Disclaimer
With the following data, which reflect our current knowledge and experience,
we wish to describe possible applications, however this information is given
without guarantee or assurance of the appropriate properties for a specific
application.

The processor is not relieved of the responsibility for incoming quality control
nor from his own testing and analysis.

All data concerning product safety (EG-guideline, BGVV, FDA) are of principle
nature and can be limitied regarding migration, temperature and type of food.
They reflect the status as of Feb. 29, 2012. To insure that this data reflects the
current state, please contact our Product Safety Department.

Should you have any questions, wishes or suggestions about CAMPUS,
please refer to the following address:

  Link to Evonik Industries AG homepage

In any case, we hope you enjoy working with CAMPUS!

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991