View list of

CAMPUS® datasheet | VESTAMID LX9102 blk (sw)


This datasheet of VESTAMID LX9102 blk (sw) from Evonik Industries AG is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:

  VESTAMID® LX9102 blk (sw) | PA12 | Evonik Industries AG
Product Texts
VESTAMID® LX9102 blk

 

Conductive nylon12 for use in multilayer tubing

 

Resin: ISO 1874-PA12-HIP,EHLZ,22-005

 

VESTAMID® LX9102 is a specially modified electrically conductive nylon 12 for use in conductive

multilayer tubing. VESTAMID® LX9102 can be used e.g. in multilayer tubing MLT 140.2 and

MLT 2040.2.

 

Compared to common conductive resins VESTAMID® LX9102 is characterised by a lower melt

viscosity and thus excellent extrudability also in thin layers. Use of VESTAMID® LX9102 leads to

tubing with excellent quality of the inner surface.

 

Multilayer tubing with an innermost layer made of VESTAMID® LX9102 complies with the American

automotive manufactures' requirements to avoid electrostatic charging generated by fuel flow.

Rheological propertiesdry / condUnitTest Standard
Molding shrinkage (parallel) 1.4 / * % ISO 294-4, 2577
Molding shrinkage (normal) 1.5 / * % ISO 294-4, 2577
Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus 640 / - MPa ISO 527-1/-2
Yield stress 32 / - MPa ISO 527-1/-2
Yield strain 37 / - % ISO 527-1/-2
Nominal strain at break >50 / - % ISO 527-1/-2
Charpy impact strength (+23°C) N / - kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) N / - kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 90[P] / - kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 5 / - kJ/m² ISO 179/1eA
P: Partial Break
Thermal propertiesdry / condUnitTest Standard
Melting temperature (10°C/min) 171 / * °C ISO 11357-1/-3
Temp. of deflection under load (1.80 MPa) 55 / * °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 120 / * °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 136 / * °C ISO 306
Burning Behav. at 1.5 mm nom. thickn. HB / * class IEC 60695-11-10
Thickness tested 1.6 / * mm IEC 60695-11-10
Burning Behav. at thickness h HB / * class IEC 60695-11-10
Thickness tested 3.2 / * mm IEC 60695-11-10
Electrical propertiesdry / condUnitTest Standard
Volume resistivity 100 / - Ohm*m IEC 60093
Other propertiesdry / condUnitTest Standard
Water absorption 1.5 / * % Sim. to ISO 62
Humidity absorption 0.5 / * % Sim. to ISO 62
Density 1120 / - kg/m³ ISO 1183
Characteristics
Processing
Profile Extrusion
Delivery form
Pellets
Additives
Plasticizer
Special Characteristics
Increased electrical conductivity, Anti-static
Regional Availability
Other text information
Profile extrusion

PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. At a drying temperature of 80 °C we recommend, depending on the water

content, a drying time of 8 - 16 hours. Fresh air dryers are acceptable, better would be a dry air or

vacuum dryer. Please note our product literature, plasticized resins can lose plasticizer during drying.


PROCESSING INFORMATION
Melt Temperature : 230 - 260 °C

Disclaimer
With the following data, which reflect our current knowledge and experience,
we wish to describe possible applications, however this information is given
without guarantee or assurance of the appropriate properties for a specific
application.

The processor is not relieved of the responsibility for incoming quality control
nor from his own testing and analysis.

All data concerning product safety (EG-guideline, BGVV, FDA) are of principle
nature and can be limitied regarding migration, temperature and type of food.
They reflect the status as of Feb. 29, 2012. To insure that this data reflects the
current state, please contact our Product Safety Department.

Should you have any questions, wishes or suggestions about CAMPUS,
please refer to the following address:

  Link to Evonik Industries AG homepage

In any case, we hope you enjoy working with CAMPUS!

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991