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CAMPUS® datasheet | VESTAMID Terra HS22 nc (nf)


This datasheet of VESTAMID Terra HS22 nc (nf) from Evonik Industries AG is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:

  VESTAMID® Terra HS22 nc (nf) | (PA610+PA*) | Evonik Industries AG
Product Texts
VESTAMID® Terra HS22 nc

 

Resin: ISO 1874-PA610

 

VESTAMID® Terra HS22 nc is a high viscous PA610 resin.

 

Application example: film extrusion

Mechanical propertiesValueUnitTest Standard
Tensile Modulus 2100 MPa ISO 527-1/-2
Yield stress 61 MPa ISO 527-1/-2
Yield strain 5 % ISO 527-1/-2
Nominal strain at break >50 % ISO 527-1/-2
Charpy impact strength (+23°C) N kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) N kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 7 kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 6 kJ/m² ISO 179/1eA
Thermal propertiesValueUnitTest Standard
Melting temperature (10°C/min) 222 °C ISO 11357-1/-3
Glass transition temperature (10°C/min) 48 °C ISO 11357-1/-2
Vicat softening temperature (50°C/h 50N) 196 °C ISO 306
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.6 mm IEC 60695-11-10
Burning Behav. at thickness h V-2 class IEC 60695-11-10
Thickness tested 3.2 mm IEC 60695-11-10
Other propertiesValueUnitTest Standard
Water absorption 3.3 % Sim. to ISO 62
Material specific propertiesValueUnitTest Standard
Viscosity number 220 cm³/g ISO 307, 1157, 1628
Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 270 °C ISO 294
Injection Molding, mold temperature 80 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Injection Molding, pressure at hold 70 MPa ISO 294
Characteristics
Processing
Injection Molding, Film Extrusion
Delivery form
Pellets
Regional Availability
Other text information
Injection molding

PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. At a drying temperature of 80 °C we recommend, depending on the water

content, a drying time of 8 - 16 hours. Fresh air dryers are acceptable, better would be a dry air or

vacuum dryer. Please note our product literature, plasticized resins can lose plasticizer during drying.


PROCESSING INFORMATION
Melt Temperature : 250 - 290 °C

Mold Temperature : 50- 100 °C

Film extrusion

PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. At a drying temperature of 80 °C we recommend, depending on the water

content, a drying time of 8 - 16 hours. Fresh air dryers are acceptable, better would be a dry air or

vacuum dryer. Please note our product literature, plasticized resins can lose plasticizer during drying.


PROCESSING INFORMATION
Melt Temperature : 250 - 290 °C

Mold Temperature : 50- 100 °C

Disclaimer
With the following data, which reflect our current knowledge and experience,
we wish to describe possible applications, however this information is given
without guarantee or assurance of the appropriate properties for a specific
application.

The processor is not relieved of the responsibility for incoming quality control
nor from his own testing and analysis.

All data concerning product safety (EG-guideline, BGVV, FDA) are of principle
nature and can be limitied regarding migration, temperature and type of food.
They reflect the status as of Feb. 29, 2012. To insure that this data reflects the
current state, please contact our Product Safety Department.

Should you have any questions, wishes or suggestions about CAMPUS,
please refer to the following address:

  Link to Evonik Industries AG homepage

In any case, we hope you enjoy working with CAMPUS!

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991