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offers extended functionality!CAMPUS® datasheet | VESTAMID X7373 nc (nf)
This datasheet of VESTAMID X7373 nc (nf) from Evonik Industries AG is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
Resin: ISO 1874-PA12, MHR,18-010N
VESTAMID® X7373 is an easy mold release and heat stabilized compound.
Due to its highly effective mold release agents, VESTAMID® X7373 is suitable
for the efficient production of injection molded parts with very short cycle times.
VESTAMID® X7373 is additionally nucleated to reduce the cycle time even further
and/or to reduce the shrinkage. Properties of compounds based on Polyamide 12
vary little with changing humidity due to their low moisture absorption. Parts made
of this semicrystalline material are characterized by exceptional impact strength,
low coefficient of friction and good chemical resistance.
VESTAMID® X7373 is supplied as pellets, ready for use, in moisture-proof bags.
| Rheological properties | Value | Unit | Test Standard |
| Molding shrinkage (parallel) | 0.9 | % | ISO 294-4, 2577 |
| Molding shrinkage (normal) | 1.1 | % | ISO 294-4, 2577 |
| Mechanical properties | Value | Unit | Test Standard |
| Tensile Modulus | 1500 | MPa | ISO 527-1/-2 |
| Yield stress | 47 | MPa | ISO 527-1/-2 |
| Yield strain | 5 | % | ISO 527-1/-2 |
| Nominal strain at break | >50 | % | ISO 527-1/-2 |
| Charpy impact strength (+23°C) | N | kJ/m² | ISO 179/1eU |
| Charpy impact strength (-30°C) | N | kJ/m² | ISO 179/1eU |
| Charpy notched impact strength (+23°C) | 6 | kJ/m² | ISO 179/1eA |
| Charpy notched impact strength (-30°C) | 6 | kJ/m² | ISO 179/1eA |
| Thermal properties | Value | Unit | Test Standard |
| Melting temperature (10°C/min) | 178 | °C | ISO 11357-1/-3 |
| Temp. of deflection under load (1.80 MPa) | 50 | °C | ISO 75-1/-2 |
| Temp. of deflection under load (0.45 MPa) | 130 | °C | ISO 75-1/-2 |
| Vicat softening temperature (50°C/h 50N) | 150 | °C | ISO 306 |
| Coeff. of linear therm. expansion (parallel) | 150 | E-6/K | ISO 11359-1/-2 |
| Coeff. of linear therm. expansion (normal) | 140 | E-6/K | ISO 11359-1/-2 |
| Burning Behav. at 1.5 mm nom. thickn. | HB | class | IEC 60695-11-10 |
| Thickness tested | 1.6 | mm | IEC 60695-11-10 |
| Burning Behav. at thickness h | HB | class | IEC 60695-11-10 |
| Thickness tested | 3.2 | mm | IEC 60695-11-10 |
| Electrical properties | Value | Unit | Test Standard |
| Relative permittivity (100Hz) | 4.2 | - | IEC 60250 |
| Relative permittivity (1MHz) | 3.8 | - | IEC 60250 |
| Dissipation factor (100Hz) | 750 | E-4 | IEC 60250 |
| Dissipation factor (1MHz) | 520 | E-4 | IEC 60250 |
| Volume resistivity | >1E13 | Ohm*m | IEC 60093 |
| Electric strength | 30 | kV/mm | IEC 60243-1 |
| Comparative tracking index | 600 | - | IEC 60112 |
| Other properties | Value | Unit | Test Standard |
| Water absorption | 1.4 | % | Sim. to ISO 62 |
| Humidity absorption | 0.7 | % | Sim. to ISO 62 |
| Density | 1010 | kg/m³ | ISO 1183 |
| Test specimen production | Value | Unit | Test Standard |
| Injection Molding, melt temperature | 240 | °C | ISO 294 |
| Injection Molding, mold temperature | 80 | °C | ISO 10724 |
| Injection Molding, injection velocity | 200 | mm/s | ISO 294 |
| Injection Molding, pressure at hold | 70 | MPa | ISO 294 |
PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent
on the drying temperature. At a drying temperature of 80°C we recommend, depending on the water
content, a drying time of 8 - 16 hours. Fresh air dryers are acceptable, better would be a dry air or
vacuum dryer. Please note our product literature, plasticized resins can lose plasticizer du
ring drying.
PROCESSING INFORMATION
| Melt Temperature: | 200 - 240 | °C |
| Mold Temperature: | 30 - 100 | °C |
With the following data, which reflect our current knowledge and experience, we wish to describe possible applications, however this information is given without guarantee or assurance of the appropriate properties for a specific application. The processor is not relieved of the responsibility for incoming quality control nor from his own testing and analysis. All data concerning product safety (EG-guideline, BGVV, FDA) are of principle nature and can be limitied regarding migration, temperature and type of food. They reflect the status as of Feb. 29, 2012. To insure that this data reflects the current state, please contact our Product Safety Department. Should you have any questions, wishes or suggestions about CAMPUS, please refer to the following address: Link to Evonik Industries AG homepage In any case, we hope you enjoy working with CAMPUS!
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991