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CAMPUS® datasheet | VESTODUR® X7062


This datasheet of VESTODUR® X7062 from Evonik Industries AG is provided by the international plastics database CAMPUS.

You may contact the supplier for more information about this grade.

This datasheet includes:

  VESTODUR® X7062 | PBT | Evonik Industries AG
Product Texts
VESTODUR® X7062


Resin: ISO 7792-PBT, MHMR,A11-03

 

VESTODUR® X7062 is a low viscous, heat-stabilized, black polybutylene terephthalate compound (PBT) with a

short cycle time especially formulated for laser marking. Marking is best with Nd:YAG laser. The emitted light

with the wavelength of 1064 nm changes the black color of the compound to a light color.

Rheological propertiesValueUnitTest Standard
Melt volume-flow rate, MVR 50 cm³/10min ISO 1133
Temperature 250 °C ISO 1133
Load 2.16 kg ISO 1133
Molding shrinkage, parallel 1.6 % ISO 294-4, 2577
Molding shrinkage, normal 1.6 % ISO 294-4, 2577
Mechanical propertiesValueUnitTest Standard
Tensile Modulus 2700 MPa ISO 527-1/-2
Stress at break 58 MPa ISO 527-1/-2
Strain at break 8 % ISO 527-1/-2
Charpy impact strength, +23°C 130 kJ/m² ISO 179/1eU
Charpy impact strength, -30°C 115 kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 4 kJ/m² ISO 179/1eA
Charpy notched impact strength, -30°C 3 kJ/m² ISO 179/1eA
Thermal propertiesValueUnitTest Standard
Melting temperature, 10°C/min 223 °C ISO 11357-1/-3
Glass transition temperature, 10°C/min 45 °C ISO 11357-1/-2
Temp. of deflection under load, 1.80 MPa 55 °C ISO 75-1/-2
Temp. of deflection under load, 0.45 MPa 160 °C ISO 75-1/-2
Vicat softening temperature, 50°C/h 50N 180 °C ISO 306
Coeff. of linear therm. expansion, parallel 110 E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion, normal 110 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.6 mm IEC 60695-11-10
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 0.8 mm IEC 60695-11-10
UL recognition UL - -
Electrical propertiesValueUnitTest Standard
Relative permittivity, 100Hz 3.3 - IEC 60250
Relative permittivity, 1MHz 3.5 - IEC 60250
Dissipation factor, 100Hz 20 E-4 IEC 60250
Dissipation factor, 1MHz 200 E-4 IEC 60250
Volume resistivity >1E13 Ohm*m IEC 60093
Surface resistivity 1E13 Ohm IEC 60093
Electric strength 27 kV/mm IEC 60243-1
Comparative tracking index 300 - IEC 60112
Other propertiesValueUnitTest Standard
Water absorption 0.5 % Sim. to ISO 62
Humidity absorption 0.1 % Sim. to ISO 62
Density 1310 kg/m³ ISO 1183
Rheological calculation propertiesValueUnitTest Standard
Density of melt 1110 kg/m³ -
Thermal conductivity of melt 0.19 W/(m K) -
Spec. heat capacity of melt 1700 J/(kg K) -
Ejection temperature 190 °C -
Test specimen productionValueUnitTest Standard
Processing conditions acc. ISO 7790 - ISO ....-2
Injection Molding, melt temperature 260 °C ISO 294
Injection Molding, mold temperature 80 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Injection Molding, pressure at hold 70 MPa ISO 294
Diagrams
Viscosity-shear rate , VESTODUR® X7062, PBT, Evonik Industries
Shearstress-shear rate , VESTODUR® X7062, PBT, Evonik Industries
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Additives
Release agent
Special Characteristics
Heat stabilized or stable to heat
Regional Availability
Other text information
Injection molding

PREPROCESSING INFORMATION
Maximum Water Content: 0.05 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. We recommend a drying time of approximately 5 hours at a temperature of

120°C in a fresh air dryer, better yet would be a dry air or vacuum dryer.


PROCESSING INFORMATION

Melt Temperature:240 - 280°C
Mold Temperature:50 - 120°C
Disclaimer
All listed technical data are typical values intended for your guidance.
They are given without obligation and do not constitute a materials
specification. Should you have any further questions concerning material
behavior or properties, please contact us at the following address :

for PA:           Evonik Industries AG
                     PP-HP-CRM
                     Gebäude 1227 / PB 16
                     D-45764 Marl
                     Phone: +49-(0)2365/49-2720
                     Fax:+49-(0)2365/49-2070
                     E-Mail: campusplastics@evonik.com

for PMMA:     Evonik Industries AG
                     Marketing / Campus
                     Kirschenallee
                     D-64293 Darmstadt
                     Germany
                     Phone: +49 - (0) 61 51 / 18-47 11
                     Fax: +49 - (0) 61 51 / 18-31 77
                     E-Mail: campusplastics@evonik.com
                     Internet: http://www.plexiglas-polymers.com

 

® = registered trademark

 

PLEXIGLAS® is a registered trademark of Evonik Röhm GmbH, Germany,

outside of the Americas. Within the Americas it is sold as ACRYLITE®,

which is a registered trademark of Evonik Cyro LLC, USA.

PLEXIMID® is a registered trademarks of Evonik Röhm GmbH, Germany.

CYROLITE® and XT® polymer are registered trademarks of Evonik Cyro LLC, USA.

 

This information and all further technical advice is based on our present knowledge

and experience. However, it implies no liability or other legal responsibility on our part,

including with regard to existing third party intellectual property rights, especially

patent rights. In particular, no warranty, whether express or implied, or guarantee of

product properties in the legal sense is intended or implied. We reserve the right to

make any changes according to technological progress or further developments. The

customer is not released from the obligation to conduct careful inspection and testing

of incoming goods. Performance of the product described herein should be verified by

testing, which should be carried out only by qualified experts in the sole responsibility

of a customer. Reference to trade names used by other companies is neither a

recommendation, nor does it imply that similar products could not be used.

 

NAFTA:

This information and all technical and other advice are based on Evonik’s

present knowledge and experience. However, Evonik assumes no liability for

such information or advice, including the extent to which such information or

advice may relate to third party intellectual property rights. Evonik reserves the

right to make any changes to information or advice at any time, without prior

or subsequent notice. EVONIK DISCLAIMS ALL REPRESENTATIONS AND

WARRANTIES, WHETHER EXPRESS OR IMPLIED, AND SHALL HAVE NO LIABILITY

FOR, MERCHANTABILITY OF THE PRODUCT OR ITS FITNESS FOR A PARTICULAR

PURPOSE (EVEN IF EVONIK IS AWARE OF SUCH PURPOSE), OR OTHERWISE.

EVONIK SHALL NOT BE RESPONSIBLE FOR CONSEQUENTIAL, INDIRECT OR

INCIDENTAL DAMAGES (INCLUDING LOSS OF PROFITS) OF ANY KIND. It is the

customer’s sole responsibility to arrange for inspection and testing of all

products by qualified experts. Reference to trade names used by other

companies is neither a recommendation nor an endorsement of the

corresponding product, and does not imply that similar products could not be

used.

 

Sales range and technical data subject to alteration.

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012