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CAMPUS® datasheet | VESTODUR® X9420
This datasheet of VESTODUR® X9420 from Evonik Industries AG is provided by the international plastics database CAMPUS.
Resin: ISO 7792-PBT, MGR, 11-030
VESTODUR® X9420 is particularly characterized by the following material properties:
- easy to release
- low viscose, unreinforced resin for injection molding
- resin with low fogging behavior at increased temperatures, for the manufacture of headlight bezels
| Rheological properties | Value | Unit | Test Standard |
| Melt volume-flow rate, MVR | 48 | cm³/10min | ISO 1133 |
| Temperature | 250 | °C | ISO 1133 |
| Load | 2.16 | kg | ISO 1133 |
| Molding shrinkage, parallel | 1.8 | % | ISO 294-4, 2577 |
| Molding shrinkage, normal | 2.0 | % | ISO 294-4, 2577 |
| Mechanical properties | Value | Unit | Test Standard |
| Tensile Modulus | 2700 | MPa | ISO 527-1/-2 |
| Yield stress | 60 | MPa | ISO 527-1/-2 |
| Yield strain | 8 | % | ISO 527-1/-2 |
| Nominal strain at break | 15 | % | ISO 527-1/-2 |
| Charpy impact strength, +23°C | 140 | kJ/m² | ISO 179/1eU |
| Charpy impact strength, -30°C | 115 | kJ/m² | ISO 179/1eU |
| Charpy notched impact strength, +23°C | 4 | kJ/m² | ISO 179/1eA |
| Charpy notched impact strength, -30°C | 4 | kJ/m² | ISO 179/1eA |
| Thermal properties | Value | Unit | Test Standard |
| Melting temperature, 10°C/min | 223 | °C | ISO 11357-1/-3 |
| Glass transition temperature, 10°C/min | 45 | °C | ISO 11357-1/-2 |
| Temp. of deflection under load, 1.80 MPa | 65 | °C | ISO 75-1/-2 |
| Temp. of deflection under load, 0.45 MPa | 185 | °C | ISO 75-1/-2 |
| Vicat softening temperature, 50°C/h 50N | 190 | °C | ISO 306 |
| Burning Behav. at 1.5 mm nom. thickn. | HB | class | IEC 60695-11-10 |
| Thickness tested | 1.6 | mm | IEC 60695-11-10 |
| Burning Behav. at thickness h | HB | class | IEC 60695-11-10 |
| Thickness tested | 0.8 | mm | IEC 60695-11-10 |
| Electrical properties | Value | Unit | Test Standard |
| Relative permittivity, 100Hz | 3.3 | - | IEC 60250 |
| Relative permittivity, 1MHz | 3.5 | - | IEC 60250 |
| Dissipation factor, 100Hz | 15 | E-4 | IEC 60250 |
| Dissipation factor, 1MHz | 210 | E-4 | IEC 60250 |
| Volume resistivity | 1E13 | Ohm*m | IEC 60093 |
| Surface resistivity | 1E14 | Ohm | IEC 60093 |
| Electric strength | 27 | kV/mm | IEC 60243-1 |
| Comparative tracking index | 600 | - | IEC 60112 |
| Other properties | Value | Unit | Test Standard |
| Water absorption | 0.5 | % | Sim. to ISO 62 |
| Humidity absorption | 0.13 | % | Sim. to ISO 62 |
| Density | 1310 | kg/m³ | ISO 1183 |
| Material specific properties | Value | Unit | Test Standard |
| Viscosity number | 107 | cm³/g | ISO 307, 1157, 1628 |
| Rheological calculation properties | Value | Unit | Test Standard |
| Density of melt | 1110 | kg/m³ | - |
| Thermal conductivity of melt | 0.13 | W/(m K) | - |
| Spec. heat capacity of melt | 1700 | J/(kg K) | - |
| Test specimen production | Value | Unit | Test Standard |
| Processing conditions acc. ISO | 7790 | - | ISO ....-2 |
| Injection Molding, melt temperature | 260 | °C | ISO 294 |
| Injection Molding, mold temperature | 80 | °C | ISO 10724 |
| Injection Molding, injection velocity | 200 | mm/s | ISO 294 |
| Injection Molding, pressure at hold | 70 | MPa | ISO 294 |
PREPROCESSING INFORMATION
Maximum Water Content: 0.05 %
When the water content is exceeded, the resin must be dried. The drying times is dependent on
the drying temperature. In practice a drying time of 2 - 6 hours at a temperature of 100 - 120 °C
(depending on the water content of the resin) has been found to be satisfactory. With the exeption
of fresh air dryers, all conventional dryers can be used.
PROCESSING INFORMATION
| Melt Temperature: | 250 - 280 | °C |
| Mold Temperature: | 60 - 100 | °C |
POSTPROCESSING INFORMATION
Tempering: Temperature: 120 °C
Tempering Time: 4 h
The level of internal strain in injection molded products can be reduced through tempering.
All listed technical data are typical values intended for your guidance.
They are given without obligation and do not constitute a materials
specification. Should you have any further questions concerning material
behavior or properties, please contact us at the following address :
for PA: Evonik Industries AG
PP-HP-CRM
Gebäude 1227 / PB 16
D-45764 Marl
Phone: +49-(0)2365/49-2720
Fax:+49-(0)2365/49-2070
E-Mail: campusplastics@evonik.com
for PMMA: Evonik Industries AG
Marketing / Campus
Kirschenallee
D-64293 Darmstadt
Germany
Phone: +49 - (0) 61 51 / 18-47 11
Fax: +49 - (0) 61 51 / 18-31 77
E-Mail: campusplastics@evonik.com
Internet: http://www.plexiglas-polymers.com
® = registered trademark
PLEXIGLAS® is a registered trademark of Evonik Röhm GmbH, Germany,
outside of the Americas. Within the Americas it is sold as ACRYLITE®,
which is a registered trademark of Evonik Cyro LLC, USA.
PLEXIMID® is a registered trademarks of Evonik Röhm GmbH, Germany.
CYROLITE® and XT® polymer are registered trademarks of Evonik Cyro LLC, USA.
This information and all further technical advice is based on our present knowledge
and experience. However, it implies no liability or other legal responsibility on our part,
including with regard to existing third party intellectual property rights, especially
patent rights. In particular, no warranty, whether express or implied, or guarantee of
product properties in the legal sense is intended or implied. We reserve the right to
make any changes according to technological progress or further developments. The
customer is not released from the obligation to conduct careful inspection and testing
of incoming goods. Performance of the product described herein should be verified by
testing, which should be carried out only by qualified experts in the sole responsibility
of a customer. Reference to trade names used by other companies is neither a
recommendation, nor does it imply that similar products could not be used.
NAFTA:
This information and all technical and other advice are based on Evonik’s
present knowledge and experience. However, Evonik assumes no liability for
such information or advice, including the extent to which such information or
advice may relate to third party intellectual property rights. Evonik reserves the
right to make any changes to information or advice at any time, without prior
or subsequent notice. EVONIK DISCLAIMS ALL REPRESENTATIONS AND
WARRANTIES, WHETHER EXPRESS OR IMPLIED, AND SHALL HAVE NO LIABILITY
FOR, MERCHANTABILITY OF THE PRODUCT OR ITS FITNESS FOR A PARTICULAR
PURPOSE (EVEN IF EVONIK IS AWARE OF SUCH PURPOSE), OR OTHERWISE.
EVONIK SHALL NOT BE RESPONSIBLE FOR CONSEQUENTIAL, INDIRECT OR
INCIDENTAL DAMAGES (INCLUDING LOSS OF PROFITS) OF ANY KIND. It is the
customer’s sole responsibility to arrange for inspection and testing of all
products by qualified experts. Reference to trade names used by other
companies is neither a recommendation nor an endorsement of the
corresponding product, and does not imply that similar products could not be
used.
Sales range and technical data subject to alteration.
CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012













