View list of

CAMPUS® datasheet | VESTODUR® X9420


This datasheet of VESTODUR® X9420 from Evonik Industries AG is provided by the international plastics database CAMPUS.

You may contact the supplier for more information about this grade.

This datasheet includes:

  VESTODUR® X9420 | PBT | Evonik Industries AG
Product Texts
 VESTODUR® X9420

 

Resin: ISO 7792-PBT, MGR, 11-030

 

VESTODUR® X9420 is particularly characterized by the following material properties:

 

  • easy to release
  • low viscose, unreinforced resin for injection molding
  • resin with low fogging behavior at increased temperatures, for the manufacture of headlight bezels
Rheological propertiesValueUnitTest Standard
Melt volume-flow rate, MVR 48 cm³/10min ISO 1133
Temperature 250 °C ISO 1133
Load 2.16 kg ISO 1133
Molding shrinkage, parallel 1.8 % ISO 294-4, 2577
Molding shrinkage, normal 2.0 % ISO 294-4, 2577
Mechanical propertiesValueUnitTest Standard
Tensile Modulus 2700 MPa ISO 527-1/-2
Yield stress 60 MPa ISO 527-1/-2
Yield strain 8 % ISO 527-1/-2
Nominal strain at break 15 % ISO 527-1/-2
Charpy impact strength, +23°C 140 kJ/m² ISO 179/1eU
Charpy impact strength, -30°C 115 kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 4 kJ/m² ISO 179/1eA
Charpy notched impact strength, -30°C 4 kJ/m² ISO 179/1eA
Thermal propertiesValueUnitTest Standard
Melting temperature, 10°C/min 223 °C ISO 11357-1/-3
Glass transition temperature, 10°C/min 45 °C ISO 11357-1/-2
Temp. of deflection under load, 1.80 MPa 65 °C ISO 75-1/-2
Temp. of deflection under load, 0.45 MPa 185 °C ISO 75-1/-2
Vicat softening temperature, 50°C/h 50N 190 °C ISO 306
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.6 mm IEC 60695-11-10
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 0.8 mm IEC 60695-11-10
Electrical propertiesValueUnitTest Standard
Relative permittivity, 100Hz 3.3 - IEC 60250
Relative permittivity, 1MHz 3.5 - IEC 60250
Dissipation factor, 100Hz 15 E-4 IEC 60250
Dissipation factor, 1MHz 210 E-4 IEC 60250
Volume resistivity 1E13 Ohm*m IEC 60093
Surface resistivity 1E14 Ohm IEC 60093
Electric strength 27 kV/mm IEC 60243-1
Comparative tracking index 600 - IEC 60112
Other propertiesValueUnitTest Standard
Water absorption 0.5 % Sim. to ISO 62
Humidity absorption 0.13 % Sim. to ISO 62
Density 1310 kg/m³ ISO 1183
Material specific propertiesValueUnitTest Standard
Viscosity number 107 cm³/g ISO 307, 1157, 1628
Rheological calculation propertiesValueUnitTest Standard
Density of melt 1110 kg/m³ -
Thermal conductivity of melt 0.13 W/(m K) -
Spec. heat capacity of melt 1700 J/(kg K) -
Test specimen productionValueUnitTest Standard
Processing conditions acc. ISO 7790 - ISO ....-2
Injection Molding, melt temperature 260 °C ISO 294
Injection Molding, mold temperature 80 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Injection Molding, pressure at hold 70 MPa ISO 294
Characteristics
Processing
Injection Molding
Delivery form
Granules
Additives
Release agent
Regional Availability
Other text information
Injection molding

PREPROCESSING INFORMATION
Maximum Water Content: 0.05 %
When the water content is exceeded, the resin must be dried. The drying times is dependent on

the drying temperature. In practice a drying time of 2 - 6 hours at a temperature of 100 - 120 °C

(depending on the water content of the resin) has been found to be satisfactory. With the exeption

of fresh air dryers, all conventional dryers can be used.

 

PROCESSING INFORMATION

Melt Temperature:   250 - 280°C
Mold Temperature:     60 - 100°C

POSTPROCESSING INFORMATION

Tempering:  Temperature:     120 °C

                  Tempering Time:    4 h

 

The level of internal strain in injection molded products can be reduced through tempering.

Disclaimer
All listed technical data are typical values intended for your guidance.
They are given without obligation and do not constitute a materials
specification. Should you have any further questions concerning material
behavior or properties, please contact us at the following address :

for PA:           Evonik Industries AG
                     PP-HP-CRM
                     Gebäude 1227 / PB 16
                     D-45764 Marl
                     Phone: +49-(0)2365/49-2720
                     Fax:+49-(0)2365/49-2070
                     E-Mail: campusplastics@evonik.com

for PMMA:     Evonik Industries AG
                     Marketing / Campus
                     Kirschenallee
                     D-64293 Darmstadt
                     Germany
                     Phone: +49 - (0) 61 51 / 18-47 11
                     Fax: +49 - (0) 61 51 / 18-31 77
                     E-Mail: campusplastics@evonik.com
                     Internet: http://www.plexiglas-polymers.com

 

® = registered trademark

 

PLEXIGLAS® is a registered trademark of Evonik Röhm GmbH, Germany,

outside of the Americas. Within the Americas it is sold as ACRYLITE®,

which is a registered trademark of Evonik Cyro LLC, USA.

PLEXIMID® is a registered trademarks of Evonik Röhm GmbH, Germany.

CYROLITE® and XT® polymer are registered trademarks of Evonik Cyro LLC, USA.

 

This information and all further technical advice is based on our present knowledge

and experience. However, it implies no liability or other legal responsibility on our part,

including with regard to existing third party intellectual property rights, especially

patent rights. In particular, no warranty, whether express or implied, or guarantee of

product properties in the legal sense is intended or implied. We reserve the right to

make any changes according to technological progress or further developments. The

customer is not released from the obligation to conduct careful inspection and testing

of incoming goods. Performance of the product described herein should be verified by

testing, which should be carried out only by qualified experts in the sole responsibility

of a customer. Reference to trade names used by other companies is neither a

recommendation, nor does it imply that similar products could not be used.

 

NAFTA:

This information and all technical and other advice are based on Evonik’s

present knowledge and experience. However, Evonik assumes no liability for

such information or advice, including the extent to which such information or

advice may relate to third party intellectual property rights. Evonik reserves the

right to make any changes to information or advice at any time, without prior

or subsequent notice. EVONIK DISCLAIMS ALL REPRESENTATIONS AND

WARRANTIES, WHETHER EXPRESS OR IMPLIED, AND SHALL HAVE NO LIABILITY

FOR, MERCHANTABILITY OF THE PRODUCT OR ITS FITNESS FOR A PARTICULAR

PURPOSE (EVEN IF EVONIK IS AWARE OF SUCH PURPOSE), OR OTHERWISE.

EVONIK SHALL NOT BE RESPONSIBLE FOR CONSEQUENTIAL, INDIRECT OR

INCIDENTAL DAMAGES (INCLUDING LOSS OF PROFITS) OF ANY KIND. It is the

customer’s sole responsibility to arrange for inspection and testing of all

products by qualified experts. Reference to trade names used by other

companies is neither a recommendation nor an endorsement of the

corresponding product, and does not imply that similar products could not be

used.

 

Sales range and technical data subject to alteration.

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012