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CAMPUS® datasheet | VESTODUR HI19-S3 nc (nf)


This datasheet of VESTODUR HI19-S3 nc (nf) from Evonik Industries AG is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:

  VESTODUR® HI19-S3 nc (nf) | PBT | Evonik Industries AG
Product Texts
VESTODUR® HI 19-S3 nc


Modified polybutylene terephthalate compound with increased heat and engine oil resistance.

VESTODUR® HI19-S3 nf is a modified polybutylene terephthalate compound with a higher flexibility

for injection molding or extrusion. It is optimized in its resistance to heat and engine oil.

Rheological propertiesValueUnitTest Standard
Melt volume-flow rate (MVR) 12 cm³/10min ISO 1133
Temperature 250 °C ISO 1133
Load 2.16 kg ISO 1133
Molding shrinkage (parallel) 1.4 % ISO 294-4, 2577
Molding shrinkage (normal) 1.4 % ISO 294-4, 2577
Mechanical propertiesValueUnitTest Standard
Tensile Modulus 420 MPa ISO 527-1/-2
Yield stress 27 MPa ISO 527-1/-2
Yield strain 23 % ISO 527-1/-2
Nominal strain at break >50 % ISO 527-1/-2
Charpy impact strength (+23°C) N kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) N kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 25 kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 8 kJ/m² ISO 179/1eA
Thermal propertiesValueUnitTest Standard
Melting temperature (10°C/min) 200 °C ISO 11357-1/-3
Temp. of deflection under load (1.80 MPa) 50 °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 110 °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 125 °C ISO 306
Coeff. of linear therm. expansion (parallel) 150 E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion (normal) 150 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.6 mm IEC 60695-11-10
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 0.8 mm IEC 60695-11-10
Electrical propertiesValueUnitTest Standard
Relative permittivity (100Hz) 4 - IEC 60250
Relative permittivity (1MHz) 3.6 - IEC 60250
Dissipation factor (100Hz) 220 E-4 IEC 60250
Dissipation factor (1MHz) 330 E-4 IEC 60250
Volume resistivity >1E13 Ohm*m IEC 60093
Surface resistivity >1E15 Ohm IEC 60093
Electric strength 27 kV/mm IEC 60243-1
Comparative tracking index 600 - IEC 60112
Other propertiesValueUnitTest Standard
Water absorption 0.35 % Sim. to ISO 62
Density 1260 kg/m³ ISO 1183
Test specimen productionValueUnitTest Standard
Processing conditions acc. ISO 7790 - ISO ....-2
Injection Molding, melt temperature 260 °C ISO 294
Injection Molding, mold temperature 80 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Injection Molding, pressure at hold 70 MPa ISO 294
Characteristics
Processing
Injection Molding, Film Extrusion, Profile Extrusion
Delivery form
Pellets
Special Characteristics
Heat stabilized or stable to heat
Regional Availability
Other text information
Injection molding

PREPROCESSING INFORMATION
Maximum Water Content: 0.05 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. We recommend a drying time of approximately 5 hours at a temperature of

120°Cin a fresh air dryer, better yet would be a dry air or vacuum dryer.


PROCESSING INFORMATION

Melt Temperature:240 - 270°C
Mold Temperature:50 - 120°C
Film extrusion

PREPROCESSING INFORMATION
Maximum Water Content: 0.05 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. We recommend a drying time of approximately 5 hours at a temperature of

120°C in a fresh air dryer, better yet would be a dry air or vacuum dryer.

PROCESSING INFORMATION
Melt Temperature : 220 - 260 °C

Profile extrusion

PREPROCESSING INFORMATION
Maximum Water Content: 0.05 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. We recommend a drying time of approximately 5 hours at a temperature of

120°C in a fresh air dryer, better yet would be a dry air or vacuum dryer.


PROCESSING INFORMATION
Melt Temperature : 220 - 260 °C

Disclaimer
With the following data, which reflect our current knowledge and experience,
we wish to describe possible applications, however this information is given
without guarantee or assurance of the appropriate properties for a specific
application.

The processor is not relieved of the responsibility for incoming quality control
nor from his own testing and analysis.

All data concerning product safety (EG-guideline, BGVV, FDA) are of principle
nature and can be limitied regarding migration, temperature and type of food.
They reflect the status as of Feb. 29, 2012. To insure that this data reflects the
current state, please contact our Product Safety Department.

Should you have any questions, wishes or suggestions about CAMPUS,
please refer to the following address:

  Link to Evonik Industries AG homepage

In any case, we hope you enjoy working with CAMPUS!

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CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991