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offers extended functionality!CAMPUS® datasheet | VESTODUR X7061 nc (nf)
This datasheet of VESTODUR X7061 nc (nf) from Evonik Industries AG is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
Resin: ISO 7792-PBT, MHMR,A11-03
The electrotechnical industries need for their components an economical and reliable marking process. During
the last years laser marking has been developed as an alternative process to conventional marking methods.
VESTODUR® X7061 is an easy-flow heat-stabilized and fast solidifying polybutylene terephthalate injection mol-
ding compound which has been developed for laser marking. Products made of X7061 permit an efficient and
fast laser marking. The characteristic properties of PBT remain unchanged:
- high heat deflection temperature
- high rigidity
- very low moisture absorption and high dimensional stability
- high hardness and strength
- good friction properties, low abrasion
- low creep, good long-term performance
- good electrical properties
- resistance to chemicals and weathering
- good processability
- no tendency to stress cracking
VESTODUR® X7061 is a special compound which makes it suitable for marking by a Nd:YAG-laser. The emitted
radiation with a wavelength of 1064 nm (near infrared) causes a color change into a deep brown-black, regardless
of the initial color of the compound. Besides an intense contrast, especially in cases of bright colors of the com-
pound, the quality of the surface meets high demands. The surface of the products is not deteriorated; the good
abrasion and chemical resistances are maintained. The main advantage of the process is the high degree of versatility.
Changes in layout are simply realised by appropriate software of the controlling computer. That permits cost-effective,
long lasting and well legible marking, even with frequent changes in layout.
Typical applications:
Electrical industry: Switches, relays, housings, connectors, coils, cable identifications
Electronic industry: Active and passive components as condensers and relays
Data processing and telecommunication: Parts of housings, key tops of keyboards and phone sets, computers,
cellular phones etc
Other applications: Fraud-proof labels and stickers for apparatus or assemblies
| Rheological properties | Value | Unit | Test Standard |
| Melt volume-flow rate (MVR) | 50 | cm³/10min | ISO 1133 |
| Temperature | 250 | °C | ISO 1133 |
| Load | 2.16 | kg | ISO 1133 |
| Molding shrinkage (parallel) | 1.6 | % | ISO 294-4, 2577 |
| Molding shrinkage (normal) | 1.6 | % | ISO 294-4, 2577 |
| Mechanical properties | Value | Unit | Test Standard |
| Tensile Modulus | 2700 | MPa | ISO 527-1/-2 |
| Stress at break | 58 | MPa | ISO 527-1/-2 |
| Strain at break | 8 | % | ISO 527-1/-2 |
| Charpy impact strength (+23°C) | 130 | kJ/m² | ISO 179/1eU |
| Charpy impact strength (-30°C) | 115 | kJ/m² | ISO 179/1eU |
| Charpy notched impact strength (+23°C) | 4 | kJ/m² | ISO 179/1eA |
| Charpy notched impact strength (-30°C) | 3 | kJ/m² | ISO 179/1eA |
| Thermal properties | Value | Unit | Test Standard |
| Melting temperature (10°C/min) | 223 | °C | ISO 11357-1/-3 |
| Glass transition temperature (10°C/min) | 45 | °C | ISO 11357-1/-2 |
| Temp. of deflection under load (1.80 MPa) | 55 | °C | ISO 75-1/-2 |
| Temp. of deflection under load (0.45 MPa) | 160 | °C | ISO 75-1/-2 |
| Vicat softening temperature (50°C/h 50N) | 190 | °C | ISO 306 |
| Coeff. of linear therm. expansion (parallel) | 110 | E-6/K | ISO 11359-1/-2 |
| Coeff. of linear therm. expansion (normal) | 110 | E-6/K | ISO 11359-1/-2 |
| Burning Behav. at 1.5 mm nom. thickn. | HB | class | IEC 60695-11-10 |
| Thickness tested | 1.6 | mm | IEC 60695-11-10 |
| Burning Behav. at thickness h | HB | class | IEC 60695-11-10 |
| Thickness tested | 0.8 | mm | IEC 60695-11-10 |
| UL recognition | UL | - | - |
| Electrical properties | Value | Unit | Test Standard |
| Relative permittivity (100Hz) | 3.3 | - | IEC 60250 |
| Relative permittivity (1MHz) | 3.5 | - | IEC 60250 |
| Dissipation factor (100Hz) | 20 | E-4 | IEC 60250 |
| Dissipation factor (1MHz) | 200 | E-4 | IEC 60250 |
| Volume resistivity | >1E13 | Ohm*m | IEC 60093 |
| Surface resistivity | 1E13 | Ohm | IEC 60093 |
| Electric strength | 27 | kV/mm | IEC 60243-1 |
| Comparative tracking index | 300 | - | IEC 60112 |
| Other properties | Value | Unit | Test Standard |
| Water absorption | 0.5 | % | Sim. to ISO 62 |
| Humidity absorption | 0.1 | % | Sim. to ISO 62 |
| Density | 1340 | kg/m³ | ISO 1183 |
| Rheological calculation properties | Value | Unit | Test Standard |
| Density of melt | 1140 | kg/m³ | - |
| Thermal conductivity of melt | 0.19 | W/(m K) | - |
| Spec. heat capacity melt | 1700 | J/(kg K) | - |
| Ejection temperature | 190 | °C | - |
| Test specimen production | Value | Unit | Test Standard |
| Processing conditions acc. ISO | 7790 | - | ISO ....-2 |
| Injection Molding, melt temperature | 260 | °C | ISO 294 |
| Injection Molding, mold temperature | 80 | °C | ISO 10724 |
| Injection Molding, injection velocity | 200 | mm/s | ISO 294 |
| Injection Molding, pressure at hold | 70 | MPa | ISO 294 |
PREPROCESSING INFORMATION
Maximum Water Content: 0.05 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent
on the drying temperature. We recommend a drying time of approximately 5 hours at a temperature of
120°C in a fresh air dryer, better yet would be a dry air or vacuum dryer.
PROCESSING INFORMATION
| Melt Temperature: | 240 - 280 | °C |
| Mold Temperature: | 50 - 120 | °C |
With the following data, which reflect our current knowledge and experience, we wish to describe possible applications, however this information is given without guarantee or assurance of the appropriate properties for a specific application. The processor is not relieved of the responsibility for incoming quality control nor from his own testing and analysis. All data concerning product safety (EG-guideline, BGVV, FDA) are of principle nature and can be limitied regarding migration, temperature and type of food. They reflect the status as of Feb. 29, 2012. To insure that this data reflects the current state, please contact our Product Safety Department. Should you have any questions, wishes or suggestions about CAMPUS, please refer to the following address: Link to Evonik Industries AG homepage In any case, we hope you enjoy working with CAMPUS!
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991