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CAMPUS® datasheet | VESTODUR X9405 nc (nf)


This datasheet of VESTODUR X9405 nc (nf) from Evonik Industries AG is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:

  VESTODUR® X9405 nc (nf) | PBT-GF30 FR(17) | Evonik Industries AG
Product Texts
VESTODUR® X9405 nc


Resin: ISO 7792-PBT,MFHP, A10-07,GF30

 

VESTODUR® X9405 is a 30% glass fiber reinforced, self-extinguishing, high impact modified polybutylene terephthalate

compound with increased comparative tracking index for injection molding process. The resin has been developed for

moldings in the electrotechnical industry, where high demands are required in respect of tracking resistance.
Test bars made of this resin are rated V-0 according UL94 by Underwriter Laboratories Inc., self-extinguishing and non-

dripping. The incorporated flame retardant is non-migrating and does not contain polybrominated diphenyl ether. The

additive has no corrosive effects on metal inserts or neighbouring metal parts. Laser marking with high contrasts is possible.

Rheological propertiesValueUnitTest Standard
Molding shrinkage (parallel) 0.2 % ISO 294-4, 2577
Molding shrinkage (normal) 1.7 % ISO 294-4, 2577
Mechanical propertiesValueUnitTest Standard
Tensile Modulus 9000 MPa ISO 527-1/-2
Stress at break 90 MPa ISO 527-1/-2
Strain at break 3.2 % ISO 527-1/-2
Charpy impact strength (+23°C) 80 kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) 80 kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 18 kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 13 kJ/m² ISO 179/1eA
Thermal propertiesValueUnitTest Standard
Melting temperature (10°C/min) 223 °C ISO 11357-1/-3
Vicat softening temperature (50°C/h 50N) 210 °C ISO 306
Coeff. of linear therm. expansion (parallel) 30 E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion (normal) 60 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. V-0 class IEC 60695-11-10
Thickness tested 1.6 mm IEC 60695-11-10
Burning Behav. at thickness h V-0 class IEC 60695-11-10
Thickness tested 0.4 mm IEC 60695-11-10
UL recognition UL - -
Electrical propertiesValueUnitTest Standard
Relative permittivity (100Hz) 4.1 - IEC 60250
Relative permittivity (1MHz) 3.7 - IEC 60250
Dissipation factor (100Hz) 80 E-4 IEC 60250
Dissipation factor (1MHz) 22 E-4 IEC 60250
Volume resistivity >1E13 Ohm*m IEC 60093
Surface resistivity 1E14 Ohm IEC 60093
Comparative tracking index 350 - IEC 60112
Other propertiesValueUnitTest Standard
Water absorption 0.6 % Sim. to ISO 62
Density 1700 kg/m³ ISO 1183
Test specimen productionValueUnitTest Standard
Processing conditions acc. ISO 7790 - ISO ....-2
Injection Molding, melt temperature 260 °C ISO 294
Injection Molding, mold temperature 80 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Injection Molding, pressure at hold 70 MPa ISO 294
Diagrams
Specific volume-temperature (pvT) , VESTODUR® X9405 nc (nf), PBT-GF30 FR(17), Evonik Degussa
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Additives
Release agent
Special Characteristics
Heat stabilized or stable to heat
Regional Availability
Other text information
Injection molding

PREPROCESSING INFORMATION
Maximum Water Content: 0.05 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. We recommend a drying time of approximately 5 hours at a temperature of

120°C in a fresh air dryer, better yet would be a dry air or vacuum dryer.

PROCESSING INFORMATION

Melt Temperature:240 - 280°C
Mold Temperature:50 - 120°C
Disclaimer
With the following data, which reflect our current knowledge and experience,
we wish to describe possible applications, however this information is given
without guarantee or assurance of the appropriate properties for a specific
application.

The processor is not relieved of the responsibility for incoming quality control
nor from his own testing and analysis.

All data concerning product safety (EG-guideline, BGVV, FDA) are of principle
nature and can be limitied regarding migration, temperature and type of food.
They reflect the status as of Feb. 29, 2012. To insure that this data reflects the
current state, please contact our Product Safety Department.

Should you have any questions, wishes or suggestions about CAMPUS,
please refer to the following address:

  Link to Evonik Industries AG homepage

In any case, we hope you enjoy working with CAMPUS!

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CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991