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offers extended functionality!CAMPUS® datasheet | VESTODUR X9417 blk (sw) E70286
This datasheet of VESTODUR X9417 blk (sw) E70286 from Evonik Industries AG is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
Glass fiber reinforced polybutylene terephthalate compound for parts with high surface quality.
VESTODUR® X9417 blk E70286 is a 15% glass fiber reinforced, polymer-modified polybutylene
terephthalate compound for injection molding. The compound is suitable for parts that are sub-
jected to high mechanical and thermal loads. Compared with commonly used glass fiber rein-
forced PBT compounds with similar stiffness parts of VESTODUR® X9417 blk E70286 have in
particular a high surface quality.
| Rheological properties | Value | Unit | Test Standard |
| Melt volume-flow rate (MVR) | 35 | cm³/10min | ISO 1133 |
| Temperature | 250 | °C | ISO 1133 |
| Load | 5 | kg | ISO 1133 |
| Molding shrinkage (parallel) | 0.4 | % | ISO 294-4, 2577 |
| Molding shrinkage (normal) | 1.5 | % | ISO 294-4, 2577 |
| Mechanical properties | Value | Unit | Test Standard |
| Tensile Modulus | 6000 | MPa | ISO 527-1/-2 |
| Stress at break | 100 | MPa | ISO 527-1/-2 |
| Strain at break | 2.6 | % | ISO 527-1/-2 |
| Charpy impact strength (+23°C) | 25 | kJ/m² | ISO 179/1eU |
| Charpy impact strength (-30°C) | 25 | kJ/m² | ISO 179/1eU |
| Charpy notched impact strength (+23°C) | 5 | kJ/m² | ISO 179/1eA |
| Charpy notched impact strength (-30°C) | 5 | kJ/m² | ISO 179/1eA |
| Thermal properties | Value | Unit | Test Standard |
| Temp. of deflection under load (1.80 MPa) | 190 | °C | ISO 75-1/-2 |
| Temp. of deflection under load (0.45 MPa) | 215 | °C | ISO 75-1/-2 |
| Vicat softening temperature (50°C/h 50N) | 205 | °C | ISO 306 |
| Coeff. of linear therm. expansion (parallel) | 70 | E-6/K | ISO 11359-1/-2 |
| Coeff. of linear therm. expansion (normal) | 100 | E-6/K | ISO 11359-1/-2 |
| Burning Behav. at 1.5 mm nom. thickn. | HB | class | IEC 60695-11-10 |
| Thickness tested | 1.6 | mm | IEC 60695-11-10 |
| Burning Behav. at thickness h | HB | class | IEC 60695-11-10 |
| Thickness tested | 0.8 | mm | IEC 60695-11-10 |
| Electrical properties | Value | Unit | Test Standard |
| Relative permittivity (100Hz) | 4 | - | IEC 60250 |
| Volume resistivity | 1E13 | Ohm*m | IEC 60093 |
| Surface resistivity | 1E14 | Ohm | IEC 60093 |
| Electric strength | 27 | kV/mm | IEC 60243-1 |
| Comparative tracking index | 325 | - | IEC 60112 |
| Other properties | Value | Unit | Test Standard |
| Water absorption | 0.5 | % | Sim. to ISO 62 |
| Density | 1450 | kg/m³ | ISO 1183 |
| Test specimen production | Value | Unit | Test Standard |
| Processing conditions acc. ISO | 7790 | - | ISO ....-2 |
| Injection Molding, melt temperature | 260 | °C | ISO 294 |
| Injection Molding, mold temperature | 80 | °C | ISO 10724 |
| Injection Molding, injection velocity | 200 | mm/s | ISO 294 |
| Injection Molding, pressure at hold | 70 | MPa | ISO 294 |
PREPROCESSING INFORMATION
Maximum Water Content: 0.05 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent
on the drying temperature. We recommend a drying time of approximately 5 hours at a temperature of
120°C in a fresh air dryer, better yet would be a dry air or vacuum dryer.
PROCESSING INFORMATION
| Melt Temperature: | 240 - 280 | °C |
| Mold Temperature: | 50 - 120 | °C |
With the following data, which reflect our current knowledge and experience, we wish to describe possible applications, however this information is given without guarantee or assurance of the appropriate properties for a specific application. The processor is not relieved of the responsibility for incoming quality control nor from his own testing and analysis. All data concerning product safety (EG-guideline, BGVV, FDA) are of principle nature and can be limitied regarding migration, temperature and type of food. They reflect the status as of Feb. 29, 2012. To insure that this data reflects the current state, please contact our Product Safety Department. Should you have any questions, wishes or suggestions about CAMPUS, please refer to the following address: Link to Evonik Industries AG homepage In any case, we hope you enjoy working with CAMPUS!
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991













