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CAMPUS® datasheet | VESTODUR X9420


This datasheet of VESTODUR X9420 from Evonik Industries AG is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:
Rheological properties - Mechanical properties - Thermal properties - Electrical properties - Other properties - Material specific properties - Rheological calculation properties - Test specimen production
  VESTODUR® X9420 | PBT | Evonik Industries AG
Product Texts
 VESTODUR® X9420

 

Resin: ISO 7792-PBT, MGR, 11-030

 

VESTODUR® X9420 is particularly characterized by the following material properties:

 

  • easy to release
  • low viscose, unreinforced resin for injection molding
  • resin with low fogging behavior at increased temperatures, for the manufacture of headlight bezels
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Rheological propertiesValueUnitTest Standard
Melt volume-flow rate (MVR) 48 cm³/10min ISO 1133
Temperature 250 °C ISO 1133
Load 2.16 kg ISO 1133
Molding shrinkage (parallel) 1.8 % ISO 294-4, 2577
Molding shrinkage (normal) 2.0 % ISO 294-4, 2577
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Mechanical propertiesValueUnitTest Standard
Tensile Modulus 2700 MPa ISO 527-1/-2
Yield stress 60 MPa ISO 527-1/-2
Yield strain 8 % ISO 527-1/-2
Nominal strain at break 15 % ISO 527-1/-2
Charpy impact strength (+23°C) 140 kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) 115 kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 4 kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 4 kJ/m² ISO 179/1eA
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Thermal propertiesValueUnitTest Standard
Melting temperature (10°C/min) 223 °C ISO 11357-1/-3
Glass transition temperature (10°C/min) 45 °C ISO 11357-1/-2
Temp. of deflection under load (1.80 MPa) 65 °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 185 °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 190 °C ISO 306
Coeff. of linear therm. expansion (parallel) 1 E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion (normal) 1 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.6 mm IEC 60695-11-10
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 0.8 mm IEC 60695-11-10
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Electrical propertiesValueUnitTest Standard
Relative permittivity (100Hz) 3.3 - IEC 60250
Relative permittivity (1MHz) 3.5 - IEC 60250
Dissipation factor (100Hz) 15 E-4 IEC 60250
Dissipation factor (1MHz) 210 E-4 IEC 60250
Volume resistivity 1E13 Ohm*m IEC 60093
Surface resistivity 1E14 Ohm IEC 60093
Electric strength 27 kV/mm IEC 60243-1
Comparative tracking index 600 - IEC 60112
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Other propertiesValueUnitTest Standard
Water absorption 0.5 % Sim. to ISO 62
Humidity absorption 0.13 % Sim. to ISO 62
Density 1310 kg/m³ ISO 1183
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Material specific propertiesValueUnitTest Standard
Viscosity number 107 cm³/g ISO 307, 1157, 1628
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Rheological calculation propertiesValueUnitTest Standard
Density of melt 1110 kg/m³ -
Thermal conductivity of melt 0.13 W/(m K) -
Spec. heat capacity melt 1700 J/(kg K) -
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Test specimen productionValueUnitTest Standard
Processing conditions acc. ISO 7790 - ISO ....-2
Injection Molding, melt temperature 260 °C ISO 294
Injection Molding, mold temperature 80 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Injection Molding, pressure at hold 70 MPa ISO 294
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Characteristics
Processing
Injection Molding
Delivery form
Granules
Additives
Release agent
Regional Availability
North America, Europe, Asia Pacific, South and Central America, Near East/Africa
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Other text information
Injection molding

PREPROCESSING INFORMATION
Maximum Water Content: 0.05 %
When the water content is exceeded, the resin must be dried. The drying times is dependent on

the drying temperature. In practice a drying time of 2 - 6 hours at a temperature of 100 - 120 °C

(depending on the water content of the resin) has been found to be satisfactory. With the exeption

of fresh air dryers, all conventional dryers can be used.

 

PROCESSING INFORMATION

Melt Temperature:   250 - 280°C
Mold Temperature:     60 - 100°C

POSTPROCESSING INFORMATION

Tempering:  Temperature:     120 °C

                  Tempering Time:    4 h

 

The level of internal strain in injection molded products can be reduced through tempering.

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Chemical Media Resistance
Acids
Acetic Acid (5% by mass) (23°C)
Citric Acid solution (10% by mass) (23°C)
Hydrochloric Acid (36% by mass) (23°C)
Nitric Acid (40% by mass) (23°C)
Sulfuric Acid (38% by mass) (23°C)
Sulfuric Acid (5% by mass) (23°C)
Bases
Sodium Hydroxide solution (35% by mass) (23°C)
Sodium Hydroxide solution (1% by mass) (23°C)
Ammonium Hydroxide solution (10% by mass) (23°C)
Alcohols
Isopropyl alcohol (23°C)
Methanol (23°C)
Ethanol (23°C)
Hydrocarbons
n-Hexane (23°C)
iso-Octane (23°C)
Ketones
Acetone (23°C)
Ethers
Diethyl ether (23°C)
Mineral oils
SAE 10W40 multigrade motor oil (23°C)
Insulating Oil (23°C)
Standard Fuels
Standard fuel without alcohol (pref. ISO 1817 Liquid C) (23°C)
Standard fuel with alcohol (pref. ISO 1817 Liquid 4) (23°C)
Diesel fuel (pref. ISO 1817 Liquid F) (23°C)
Salt solutions
Sodium Chloride solution (10% by mass) (23°C)
Sodium Hypochlorite solution (10% by mass) (23°C)
Sodium Carbonate solution (20% by mass) (23°C)
Sodium Carbonate solution (2% by mass) (23°C)
Other
Ethyl Acetate (23°C)
Ethylene Glycol (50% by mass) in water (108°C)
Water (23°C)
Deionized water (90°C)
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Disclaimer
With the following data, which reflect our current knowledge and experience,
we wish to describe possible applications, however this information is given
without guarantee or assurance of the appropriate properties for a specific
application.

The processor is not relieved of the responsibility for incoming quality control
nor from his own testing and analysis.

All data concerning product safety (EG-guideline, BGVV, FDA) are of principle
nature and can be limitied regarding migration, temperature and type of food.
They reflect the status as of Feb. 29, 2012. To insure that this data reflects the
current state, please contact our Product Safety Department.

Should you have any questions, wishes or suggestions about CAMPUS,
please refer to the following address:

  Link to Evonik Industries AG homepage

In any case, we hope you enjoy working with CAMPUS!
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CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991