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offers extended functionality!CAMPUS® datasheet | VESTORAN 1900 nc (nf)
This datasheet of VESTORAN 1900 nc (nf) from Evonik Industries AG is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
Unfilled, amorphous PPE resin.
As a material of amorphous structure VESTORAN® 1900 nc shows very small mold shrinkage.
Therefore molded parts have a very low tendency to warp. The impact modified compound is of
low density and easy to process. Further properties are excellent impact strength, heat deflec-
tion under load and suitability for being coated with lacquers.
Moldings of VESTORAN® 1900 nc are dimensionally stable and hydrolysis resistant even in hot
water, but are more sensitive to organic solvents than semi-crystalline plastics.
VESTORAN® 1900 nc is resistant to aqueous alkalines and acides, certain alcohols, and glycol
solutions.
VESTORAN® 1900 nc is particularly suitable for the adhesion promoter-free manufacturing of
plastic/ rubber composites by the Evonik Industries AG K&K process.
VESTORAN® 1900 nc is supplied as cylindrical granules in PE- bags.
| Rheological properties | Value | Unit | Test Standard |
| Melt volume-flow rate (MVR) | 40 | cm³/10min | ISO 1133 |
| Temperature | 300 | °C | ISO 1133 |
| Load | 21.6 | kg | ISO 1133 |
| Molding shrinkage (parallel) | 0.9 | % | ISO 294-4, 2577 |
| Molding shrinkage (normal) | 0.8 | % | ISO 294-4, 2577 |
| Mechanical properties | Value | Unit | Test Standard |
| Tensile Modulus | 2000 | MPa | ISO 527-1/-2 |
| Yield stress | 60 | MPa | ISO 527-1/-2 |
| Yield strain | 6 | % | ISO 527-1/-2 |
| Nominal strain at break | >50 | % | ISO 527-1/-2 |
| Tensile creep modulus (1h) | 2000 | MPa | ISO 899-1 |
| Tensile creep modulus (1000h) | 2000 | MPa | ISO 899-1 |
| Charpy impact strength (+23°C) | 250 | kJ/m² | ISO 179/1eU |
| Charpy notched impact strength (+23°C) | 25 | kJ/m² | ISO 179/1eA |
| Tensile notched impact strength (+23°C) | 110 | kJ/m² | ISO 8256/1 |
| Puncture - maximum force (+23°C) | 4590 | N | ISO 6603-2 |
| Puncture - maximum force (-30°C) | 5430 | N | ISO 6603-2 |
| Puncture energy (+23°C) | 39 | J | ISO 6603-2 |
| Puncture energy (-30°C) | 48 | J | ISO 6603-2 |
| Thermal properties | Value | Unit | Test Standard |
| Temp. of deflection under load (1.80 MPa) | 170 | °C | ISO 75-1/-2 |
| Temp. of deflection under load (0.45 MPa) | 190 | °C | ISO 75-1/-2 |
| Vicat softening temperature (50°C/h 50N) | 185 | °C | ISO 306 |
| Coeff. of linear therm. expansion (parallel) | 80 | E-6/K | ISO 11359-1/-2 |
| Coeff. of linear therm. expansion (normal) | 80 | E-6/K | ISO 11359-1/-2 |
| Burning Behav. at 1.5 mm nom. thickn. | HB | class | IEC 60695-11-10 |
| Thickness tested | 1.6 | mm | IEC 60695-11-10 |
| Burning Behav. at thickness h | HB | class | IEC 60695-11-10 |
| Thickness tested | 0.8 | mm | IEC 60695-11-10 |
| UL recognition | UL | - | - |
| Electrical properties | Value | Unit | Test Standard |
| Relative permittivity (100Hz) | 2.6 | - | IEC 60250 |
| Relative permittivity (1MHz) | 2.9 | - | IEC 60250 |
| Dissipation factor (100Hz) | 8 | E-4 | IEC 60250 |
| Dissipation factor (1MHz) | 16 | E-4 | IEC 60250 |
| Volume resistivity | >1E13 | Ohm*m | IEC 60093 |
| Surface resistivity | 2E14 | Ohm | IEC 60093 |
| Electric strength | 40 | kV/mm | IEC 60243-1 |
| Comparative tracking index | 225 | - | IEC 60112 |
| Other properties | Value | Unit | Test Standard |
| Density | 1040 | kg/m³ | ISO 1183 |
| Rheological calculation properties | Value | Unit | Test Standard |
| Density of melt | 900 | kg/m³ | - |
| Thermal conductivity of melt | 0.21 | W/(m K) | - |
| Spec. heat capacity melt | 1910 | J/(kg K) | - |
| Ejection temperature | 200 | °C | - |
| Test specimen production | Value | Unit | Test Standard |
| Injection Molding, melt temperature | 320 | °C | ISO 294 |
| Injection Molding, mold temperature | 80 | °C | ISO 10724 |
| Injection Molding, injection velocity | 200 | mm/s | ISO 294 |
PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the water content is exceeded, the resin must be dried.The drying time is dependent on the
drying temperature. In practice a drying time of 2 - 3 hours at a temperature of 80 - 110 °C (depen-
ding on the water content of the resin) has been found to be satisfactory.
Local overheating of the material must be avoided.
With the exeption of fresh air dryers, all conventional dryers
can be used.
PROCESSING INFORMATION
| Melt Temperature: | 310 - 340 | °C |
| Mold Temperature: | 80 - 90 | °C |
PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the water content is exceeded, the resin must be dried.The drying time is dependent on the
drying temperature. In practice a drying time of 2 - 3 hours at a temperature of 80 - 110 °C (depen-
ding on the water content of the resin) has been found to be satisfactory.
Local overheating of the material must be avoided.
With the exeption of fresh air dryers, all conventional dryers
can be used.
PROCESSING INFORMATION
| Melt Temperature: | 310 - 340 | °C |
| Mold Temperature: | 80 - 90 | °C |
PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the water content is exceeded, the resin must be dried.The drying time is dependent on the
drying temperature. In practice a drying time of 2 - 3 hours at a temperature of 80 - 110 °C (depen-
ding on the water content of the resin) has been found to be satisfactory.
Local overheating of the material must be avoided.
With the exeption of fresh air dryers, all conventional dryers
can be used.
PROCESSING INFORMATION
| Melt Temperature: | 310 - 340 | °C |
| Mold Temperature: | 80 - 90 | °C |
With the following data, which reflect our current knowledge and experience, we wish to describe possible applications, however this information is given without guarantee or assurance of the appropriate properties for a specific application. The processor is not relieved of the responsibility for incoming quality control nor from his own testing and analysis. All data concerning product safety (EG-guideline, BGVV, FDA) are of principle nature and can be limitied regarding migration, temperature and type of food. They reflect the status as of Feb. 29, 2012. To insure that this data reflects the current state, please contact our Product Safety Department. Should you have any questions, wishes or suggestions about CAMPUS, please refer to the following address: Link to Evonik Industries AG homepage In any case, we hope you enjoy working with CAMPUS!
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991