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CAMPUS® datasheet | VESTORAN 1900-GF20 blk (sw) 2.7026


This datasheet of VESTORAN 1900-GF20 blk (sw) 2.7026 from Evonik Industries AG is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:

  VESTORAN® 1900-GF20 blk (sw) 2.7026 | PPE-GF20 | Evonik Industries AG
Product Texts
VESTORAN® 1900-GF20 blk


VESTORAN® is the registered Evonik Degussa GmbH trademark for molding compounds containing poly-

2,6-dimethyl-1,4-phenylene ether as polymeric constituent (polyphenylene ether, PPE, also referred to as

PPO).
As a material of amorphous structure VESTORAN® 1900-GF20 blk 2.7026 shows very small mold shrinkage.

Therefore molded parts have a very low tendency to warp.
Moldings of VESTORAN® 1900-GF20 blk 2.7026 are dimensionally stable and hydrolysis resistant even in hot

water, but are more sensitive to organic solvents than semi-crystalline plastics.
VESTORAN® 1900-GF20 blk 2.7026 is resistant to aqueous alkalines and acides, certain alcohols, and glycol

solutions. Glass-fiber reinforcement of this molding material combines outstanding heat deflection temperature

under load with high strength and rigidity. The even smaller shrinkage compared to non-reinforced VESTORAN®

depends on the orientation of the glass fibers in the molded parts.
VESTORAN® 1900-GF20 blk 2.7026 is particularly suitable for the adhesion promoterfree manufacturing of

plastic /rubber composites by the Evonik Industries AG - patented K&K process.
Compared to VESTORAN® 1900, VESTORAN® 1900-GF20 blk 2.7026 offers higher rigidity and strength.
VESTORAN® 1900-GF20 blk 2.7026 is supplied as ready-to-process cylindrical granules in PP bags.

Rheological propertiesValueUnitTest Standard
Melt volume-flow rate (MVR) 15 cm³/10min ISO 1133
Temperature 300 °C ISO 1133
Load 21.6 kg ISO 1133
Mechanical propertiesValueUnitTest Standard
Tensile Modulus 5600 MPa ISO 527-1/-2
Stress at break 110 MPa ISO 527-1/-2
Strain at break 3 % ISO 527-1/-2
Tensile creep modulus (1h) 5100 MPa ISO 899-1
Tensile creep modulus (1000h) 2300 MPa ISO 899-1
Charpy impact strength (+23°C) 50 kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) 50 kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 12 kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 12 kJ/m² ISO 179/1eA
Tensile notched impact strength (+23°C) 260 kJ/m² ISO 8256/1
Thermal propertiesValueUnitTest Standard
Temp. of deflection under load (1.80 MPa) 185 °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 190 °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 190 °C ISO 306
Coeff. of linear therm. expansion (parallel) 40 E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion (normal) 50 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.6 mm IEC 60695-11-10
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 0.8 mm IEC 60695-11-10
UL recognition UL - -
Electrical propertiesValueUnitTest Standard
Relative permittivity (100Hz) 2.9 - IEC 60250
Relative permittivity (1MHz) 2.7 - IEC 60250
Dissipation factor (100Hz) 8 E-4 IEC 60250
Dissipation factor (1MHz) 18 E-4 IEC 60250
Volume resistivity >1E13 Ohm*m IEC 60093
Surface resistivity 1E13 Ohm IEC 60093
Comparative tracking index 175 - IEC 60112
Other propertiesValueUnitTest Standard
Water absorption 0.35 % Sim. to ISO 62
Density 1190 kg/m³ ISO 1183
Rheological calculation propertiesValueUnitTest Standard
Density of melt 1020 kg/m³ -
Thermal conductivity of melt 0.23 W/(m K) -
Spec. heat capacity melt 1690 J/(kg K) -
Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 320 °C ISO 294
Injection Molding, mold temperature 80 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Characteristics
Processing
Injection Molding, Profile Extrusion, Sheet Extrusion
Delivery form
Pellets
Special Characteristics
Heat stabilized or stable to heat
Regional Availability
Other text information
Injection molding

PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
If the given water content is exceeded or silver streaks appear on the surface of parts, the resin should be dried.

Drying should be carried out is a dry air or vacuum dryer for at least 3 to 4 hours at 90 - 120°C. The resin should

be pre-heated to 80 - 110°C before molding. If a vented plastizier zone employed preheating can be omitted.
Please refer to our product information sheets!

PROCESSING INFORMATION

Melt Temperature:280 - 320°C
Mold Temperature:70 - 120°C
In a one step K&K Process the mold temperature can be increased up to 180°C.
Profile extrusion

PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
If the given water content is exceeded or silver streaks appear on the surface of parts, the resin should be dried.

Drying should be carried out is a dry air or vacuum dryer for at least 3 to 4 hours at 90 - 120°C. The resin should

be pre-heated to 80 - 110°C before molding. If a vented plastizier zone employed preheating can be omitted.
Please refer to our product information sheets!


PROCESSING INFORMATION
Melt Temperature : 275 - 300 °C

Sheet extrusion

PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
If the given water content is exceeded or silver streaks appear on the surface of parts, the resin should be dried.

Drying should be carried out is a dry air or vacuum dryer for at least 3 to 4 hours at 90 - 120°C. The resin should

be pre-heated to 80 - 110°C before molding. If a vented plastizier zone employed preheating can be omitted.
Please refer to our product information sheets!


PROCESSING INFORMATION
Melt Temperature : 275 - 300 °C

Disclaimer
With the following data, which reflect our current knowledge and experience,
we wish to describe possible applications, however this information is given
without guarantee or assurance of the appropriate properties for a specific
application.

The processor is not relieved of the responsibility for incoming quality control
nor from his own testing and analysis.

All data concerning product safety (EG-guideline, BGVV, FDA) are of principle
nature and can be limitied regarding migration, temperature and type of food.
They reflect the status as of Feb. 29, 2012. To insure that this data reflects the
current state, please contact our Product Safety Department.

Should you have any questions, wishes or suggestions about CAMPUS,
please refer to the following address:

  Link to Evonik Industries AG homepage

In any case, we hope you enjoy working with CAMPUS!

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991