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CAMPUS® datasheet | Ultraform® W2320 003 Q600
This datasheet of Ultraform® W2320 003 Q600 from BASF is provided by the international plastics database CAMPUS.
You may contact the supplier for more information about this grade.
Ultraform® W2320 003 Q600 | POM | BASF
Texto del producto
Very free-flowing, rapidly solidifying grade for use where processing is extremely difficult but mechanical properties are lower.
Abbreviated designation according to ISO 1043: POM
Designation according to ISO 9988-1: POM-K, M-GNR, 05-002
Abbreviated designation according to ISO 1043: POM
Designation according to ISO 9988-1: POM-K, M-GNR, 05-002
| Propiedades reológicas | Valor | Unidades | Método de ensayo |
| Indice de fluidez volumétrico, MVR | 25 | cm³/10min | ISO 1133 |
| Temperatura | 190 | °C | ISO 1133 |
| Carga | 2.16 | kg | ISO 1133 |
| Propiedades mecánicas | Valor | Unidades | Método de ensayo |
| Módulo de tracción | 2800 | MPa | ISO 527-1/-2 |
| Esfuerzo de fluencia | 65 | MPa | ISO 527-1/-2 |
| Alarg. en límite elástico | 7.5 | % | ISO 527-1/-2 |
| Alarg. nominal a rotura | 24 | % | ISO 527-1/-2 |
| Módulo de plastodeformación, 1h | 2100 | MPa | ISO 899-1 |
| Módulo de plastodeformación, 1000h | 1350 | MPa | ISO 899-1 |
| Resistencia al impacto Charpy, +23°C | 150 | kJ/m² | ISO 179/1eU |
| Resistencia al impacto Charpy, -30°C | 150 | kJ/m² | ISO 179/1eU |
| Res. impacto Charpy c/entalla, +23°C | 5 | kJ/m² | ISO 179/1eA |
| Res. impacto Charpy c/entalla, -30°C | 4 | kJ/m² | ISO 179/1eA |
| Propiedades térmicas | Valor | Unidades | Método de ensayo |
| Temperatura de fusión, 10°C/min | 167 | °C | ISO 11357-1/-3 |
| Estabilidad al calor, 1.80 MPa | 100 | °C | ISO 75-1/-2 |
| Estabilidad al calor, 0.45 MPa | 156 | °C | ISO 75-1/-2 |
| Temp. reblandecimiento Vicat, 50°C/h 50N | 150 | °C | ISO 306 |
| Coef.de expansión térmica lineal, paralelo | 110 | E-6/K | ISO 11359-1/-2 |
| Combustibilidad a 1.5mm esp. nom. | HB | class | IEC 60695-11-10 |
| Espesores de probeta | 1.6 | mm | IEC 60695-11-10 |
| Valoración UL | UL | - | - |
| Combustibilidad a espesor h | HB | class | IEC 60695-11-10 |
| Espesores de probeta | 0.8 | mm | IEC 60695-11-10 |
| Valoración UL | UL | - | - |
| Combustibilidad según índice de oxigeno | 15 | % | ISO 4589-1/-2 |
| Propiedades eléctricas | Valor | Unidades | Método de ensayo |
| Constante dieléctrica, 100Hz | 3.8 | - | IEC 60250 |
| Constante dieléctrica, 1MHz | 3.8 | - | IEC 60250 |
| Factor de pérdidas dieléctricas, 100Hz | 10 | E-4 | IEC 60250 |
| Factor de pérdidas dieléctricas, 1MHz | 50 | E-4 | IEC 60250 |
| Resistividad volumétrica específica | 1E13 | Ohm*m | IEC 60093 |
| Resistividad superficial específica | 1E13 | Ohm | IEC 60093 |
| Resistencia dieléctrica | 40 | kV/mm | IEC 60243-1 |
| Indice comparativo de linea de fuga | 600 | - | IEC 60112 |
| Otras propiedades | Valor | Unidades | Método de ensayo |
| Absorción de agua | 0.8 | % | Sim. to ISO 62 |
| Absorción de humedad | 0.2 | % | Sim. to ISO 62 |
| Densidad | 1400 | kg/m³ | ISO 1183 |
| Cálculo propiedades reológicas | Valor | Unidades | Método de ensayo |
| Temperatura de expulsión | 110 | °C | - |
| Condiciones de transformación | Valor | Unidades | Método de ensayo |
| Moldeo por inyección, temperatura de la masa | 200 | °C | ISO 294 |
| Moldeo por inyección, temperatura del molde | 90 | °C | ISO 10724 |
| Moldeo por inyección, velocidad de inyección | 200 | mm/s | ISO 294 |
Funciones
Características
Procesamiento y forma de entrega
Moldeo por inyección
Forma de suministro
Sémola
Aditivos
Desmoldeante
Disponibilidad regional
Resistencia a medios químicos
Aviso
The data contained in this publication are based on our current
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.
In order to check the availability of products please contact us or our
sales agency.
For more information about our products contact your local BASF
representative or
BASF SE
Dept. PM/K
Fax: 0621-60-49497
e-mail: e-mail
CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.
In order to check the availability of products please contact us or our
sales agency.
For more information about our products contact your local BASF
representative or
BASF SE
Dept. PM/K
Fax: 0621-60-49497
e-mail: e-mail
CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)
The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH.
M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors.
Any decision about the application of materials must be double checked with the producer of this material.
CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012
CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012