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CAMPUS® datasheet | BERGAMID® B70MI20
This datasheet of BERGAMID® B70MI20 from PolyOne Engineered Materials Europe is provided by the international plastics database CAMPUS.
BERGAMID® B70MI20 | PA6-MD20 | PolyOne Engineered Materials Europe
商品の説明文
BERGAMID B70MI20, PA6 reinforced
general-purpose injection molding grade
20% minerals
general-purpose injection molding grade
20% minerals
| 機械的特性 | 乾燥/調湿 | 単位 | テスト基準 |
| 引張弾性率 | 4000 / 1700 | MPa | ISO 527-1/-2 |
| 破壊応力 | 75 / 40 | MPa | ISO 527-1/-2 |
| 破壊ひずみ | 19 / 50 | % | ISO 527-1/-2 |
| シャルピー衝撃強さ, +23°C | N / N | kJ/m² | ISO 179/1eU |
| ノッチ付きシャルピー衝撃強さ, +23°C | 9 / 20 | kJ/m² | ISO 179/1eA |
| ノッチ付きシャルピー衝撃強さ, -30°C | 7 / - | kJ/m² | ISO 179/1eA |
| 熱的特性 | 乾燥/調湿 | 単位 | テスト基準 |
| 溶融温度, 10°C/min | 223 / * | °C | ISO 11357-1/-3 |
| 荷重たわみ温度, 1.80 MPa | 60 / * | °C | ISO 75-1/-2 |
| 荷重たわみ温度, 0.45 MPa | 190 / * | °C | ISO 75-1/-2 |
| 1.5mm厚さでの燃焼性 | HB / * | class | IEC 60695-11-10 |
| 試験片の厚さ | 1.6 / * | mm | IEC 60695-11-10 |
| 厚さhでの燃焼性 | HB / * | class | IEC 60695-11-10 |
| 試験片の厚さ | 0.8 / * | mm | IEC 60695-11-10 |
| 電気的特性. | 乾燥/調湿 | 単位 | テスト基準 |
| 比誘電率, 1MHz | 3.8 / 6.2 | - | IEC 60250 |
| 誘電正接, 1MHz | 200 / 2000 | E-4 | IEC 60250 |
| 体積抵抗率 | 1E13 / 1E10 | Ohm*m | IEC 60093 |
| 表面抵抗率 | * / 1E10 | Ohm | IEC 60093 |
| 耐トラッキング性 | - / 500 | - | IEC 60112 |
| 材料特有の特性 | 乾燥/調湿 | 単位 | テスト基準 |
| 粘度数 | 150 / * | cm³/g | ISO 307, 1157, 1628 |
| 試験片の成形条件. | 値 | 単位 | テスト基準 |
| 射出成形, 樹脂温度 | 270 | °C | ISO 294 |
| 射出成形, 金型温度 | 80 | °C | ISO 10724 |
特殊な特性
成形加工法.
射出成形.
納入形状.
ペレット.
領域別の利用可能性
ヨーロッパ.
耐薬品性
Disclaimer
PolyOnePolyOne Engineered Materials Europe
PolyOne Th.Bergmann GmbH
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CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012