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CAMPUS® datasheet | BERGAMID® B70MI30
This datasheet of BERGAMID® B70MI30 from PolyOne Engineered Materials Europe is provided by the international plastics database CAMPUS.
BERGAMID® B70MI30 | PA6-MD30 | PolyOne Engineered Materials Europe
材料文字说明
BERGAMID B70MI30, PA6 reinforced
general-purpose injection molding grade
30% minerals
general-purpose injection molding grade
30% minerals
| 机械性能 | 干 / 已调节 | 单位 | 测试标准 |
| 拉伸模量 | 5200 / 2000 | MPa | ISO 527-1/-2 |
| 断裂应力 | 80 / 50 | MPa | ISO 527-1/-2 |
| 断裂伸长率 | 10 / 20 | % | ISO 527-1/-2 |
| 无缺口简支梁冲击强度, +23°C | N / N | kJ/m² | ISO 179/1eU |
| 简支梁缺口冲击强度, +23°C | 10 / 22 | kJ/m² | ISO 179/1eA |
| 简支梁缺口冲击强度, -30°C | 8 / - | kJ/m² | ISO 179/1eA |
| 热性能 | 干 / 已调节 | 单位 | 测试标准 |
| 熔融温度, 10°C/min | 223 / * | °C | ISO 11357-1/-3 |
| 热变形温度, 1.80 MPa | 70 / * | °C | ISO 75-1/-2 |
| 热变形温度, 0.45 MPa | 200 / * | °C | ISO 75-1/-2 |
| 1.5mm名义厚度时的燃烧性 | HB / * | class | IEC 60695-11-10 |
| 测试用试样的厚度 | 1.6 / * | mm | IEC 60695-11-10 |
| 厚度为h时的燃烧性 | HB / * | class | IEC 60695-11-10 |
| 测试用试样的厚度 | 0.8 / * | mm | IEC 60695-11-10 |
| 电性能 | 干 / 已调节 | 单位 | 测试标准 |
| 相对介电常数., 1MHz | 3.8 / 6.2 | - | IEC 60250 |
| 介质损耗因子, 1MHz | 200 / 2000 | E-4 | IEC 60250 |
| 体积电阻率 | 1E13 / 1E10 | Ohm*m | IEC 60093 |
| 表面电阻率 | * / 1E10 | Ohm | IEC 60093 |
| 相对漏电起痕指数 | - / 500 | - | IEC 60112 |
| 模塑测量的特殊性能 | 干 / 已调节 | 单位 | 测试标准 |
| 粘数 | 150 / * | cm³/g | ISO 307, 1157, 1628 |
典型数据
加工方法
注塑
供货形式
粒料
地区供应
欧洲
耐化学性
权利义务的法律声明
PolyOnePolyOne Engineered Materials Europe
PolyOne Th.Bergmann GmbH
PolyOne Corporation makes no representations, guarantees or warranties of any kind with respect to the information contained in this document about its accuracy, suitability for particular applications ort he result obtained or obtainable using the information. Some of the information arises from laboratory work with small-case equipment which may not provide a reliable indication of performance or properties obtained or obtainable on larger-scale equipment. Processing conditions can cause material properties to shift from the values stated in data bases. PolyOne Corporation makes no guarantees or warranties respecting suitability of either PolyOne’s products or the information for your process or end-use application. You have the responsibility to conduct full-scale end-product performance testing to determine suitability in your application, and you assume all risks and liability arising from your use of the information and/or handling of any product. PolyOne Corporation makes no warranties, express or implied, including, but not limited to, implied warranties of merchantability and fitness for a particular purpose, either with respect to the information or products reflected by the information. These information shall not operate as permission, recommendation or inducement to practice any patented invention without permission of the patent owner.
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CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012
CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012